Running 'make' will build the default project directly in the project folder (like it did before)
Running 'make RX_LANE_RATE=15 TX_LANE_RATE=15' will build the project inside the 'RXRATE15_TXRATE15' subdirectory.
Running 'make CFG=cfg/test_config.txt" will use the variables found inside the configuration file and build the project inside the 'test_config' subdirectory.
Running 'make clean' will clean the default project only.
Running 'make CFG=cfg/test_config.txt clean' will clean the 'testconfig' build.
Running 'make clean-all' will delete all the built configurations and libraries.
Note that the 'JESD' and 'LANE' words from the parameter names are stripped.
Signed-off-by: Bogdan Luncan <bogdan.luncan@analog.com>
Deleted lines after endmodule and consecutive empty lines.
Modified parentheses, extra spaces.
Fixed indentation.
Fixed parameters list to be each parameter on its line.
Signed-off-by: Iulia Moldovan <iulia.moldovan@analog.com>
Use the new util_cpack2 and util_upack2 cores. They have lower utilization
that the old util_cpack and util_upack cores.
Signed-off-by: Lars-Peter Clausen <lars@metafoo.de>
The loopback on the unused gpio inputs consumes routing resources
while does not gives any value for the software.
Connect these lines to zero instead.
Some projects use the ad_iobuf on IOs that are not bidirectional
producing synthesis warnings.
The change fixes warnings like:
[Synth 8-6104] Input port 'gpio_bd_i' has an internal driver
[Synth 8-6104] Input port 'gpio_status' has an internal driver
- remove interrupts from system_top
- for all suported carriers:
- remove all interrupt bd pins
- connect to GND all initial unconnected interrupt pins
- update ad_cpu_interrupt procedure to disconnect a interrupt from GND
before connectiong it to another pin.
Moved XCVR related connections to HP0, where the HP shares the MUX with the Video DMA
HP1 and HP2 are used for RX OS and RX DMAs, sharing the MUX. Usually they shouldn't run at the same time.
HP3 is used for TX DMA, sharing the MUX with the FPD DMA controller
All HPx and DMA buswidths have been increased to 128 bits
The HPx-DMA clock has been increased to 300 MHz
DAC FIFO address size has been increased to 17